The new Infineon 's TOLL package is optimized for high-current automotive applications such as power steering, brushless DC drives, battery management and battery safety switches. TOLL is a perfect solution for high-power applications, where ...
Infineon 's BGSF1717MN26 is a Double Pole 14 Throw (DP14T) Antenna Switch Module (ASM) optimized for wireless applications up to 3.8 GHz. It is the perfect solution for multi-mode handsets which may be using carrier aggregation based on LTE, LTE-A, ...
Infineon's latest LTE LNAs (low noise amplifiers) and quad LNA banks are designed to improve the smartphone user experience by increasing data rates by up to 96%. The BGA7x1N6 and BGM7xxxx4L families provide a low noise figure coupled with the ...
Infineon has extended its family of tailor-made modules for photovoltaic (PV) string and multi-string inverters, offering optimized inverter efficiency and performance. Fast and solder-less assembly is possible using the proven PressFIT technology. ...
Infineon Technologies expands the comprehensive SiC portfolio introducing the 5th generation 1200 V thinQ! ™ SiC Schottky diodes. The new 1200 V SiC diodes feature ultra-low forward voltage even at operating temperatures, more than 100 ...
Joint press release from the partners of the research project ”NeuLand”: AIXTRON, Infineon Technologies, SiCrystal, SMA Solar Technology New semiconductor materials could mean 50 percent less energy loss in switched-mode power supplies ...
SLS 10ERE from Infineon is a turnkey authentication product in the OPTIGA™ Trust family. It is a robust cryptographic solution that delivers enhanced protection against aftermarket replacements and helps manufacturers verify the authenticity, ...
Infineon has launched a new line of 2.6 GHz LDMOS transistors that support LTE applications. The new transistors offer excellent gain, high efficiency and high peak power. They cover a wide range of output powers from 25 W to 280 W and are ...
Infineon's family of Flex multi-channel low-side switches is designed for powertrain, safety and industrial applications. They can be used to drive a range of loads from relays, injector valves and oxygen probe heaters through general purpose ...
Infineon releas Blade 3×3 is a discrete MOSFET package with 3.0 × 3.4 mm 2 package outline. This new and revolutionary Blade packaging concept raises the bar for high-performance power packages. The packaging technology does not use ...