Movidius and Toshiba Electronics Europe collaborate on high resolution 3D system solution for smartphones

Movidius; Toshiba

Movidius, the mobile multimedia processor company, announced it has partnered with Toshiba Electronics Europe to develop a complete 3D system solution for the smartphone market.

Movidius' MA1178 has been combined with Toshiba's 8 Megapixel EDOF (extended depth of field) cameras to enable 3D camera module manufacturers to deliver a compelling 3D imaging solution, ideally suited to top of the range smartphones. EDOF cameras offer distinct advantages over traditional autofocus in terms of 3D synchronisation.

Movidius - MA1178

The Movidius MA1178 Dual ISP and video processor chip seamlessly integrates into the handset's existing platforms to simplify the design process and reduce the cost of manufacture. The Toshiba 8 Megapixel EDOF cameras and the Movidius MA1178 allow a perfect focus matching of stereoscopic images, which leads to superior 3D picture quality. The system solution offers flexibility for customers to implement a symmetric or asymmetric set up of either two 8 Megapixel EDOF cameras or a combination of 8 and 3 Megapixel EDOF cameras.

In the crowded handset market, high quality 3D imaging capabilities offer mobile manufacturers the opportunity to differentiate their offering from their competitors, providing the end user with the best quality HD 3D experience and enjoyment.

movidius.com

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