This typical QFN package uses bond wires to connect the die to an exposed pad where the power switch exhibits significant ringing (a). An improved package utilizes copper pillars and a flip-chip interconnection from the die to the lead frame, which elimin
| Authors | Steve Taranovich |
| Main Document | Article «How to Reduce EMI in Switching Power Supplies» |
| Description | Figure 3 |
| File Format / Size | PDF / 54 Kb |
| Document Language | English |
Other Materials from the Main Document
- Article «How to Reduce EMI in Switching Power Supplies»
- Figure 1. This schematic shows the EMI sources in an SMPS. (Image from Reference 8)
- Figure 2. This graph demonstrates quasi-peak measurements with and without dithering around 330 kHz, showing a 5-dB reduction due to dithering. (Image from Reference 1)
- Figure 3. This typical QFN package uses bond wires to connect the die to an exposed pad where the power switch exhibits significant ringing (a). An improved package utilizes copper pillars and a flip-chip interconnection from the die to the lead frame, which elimin
- Figure 4. This high-performance filter design, with no magnetic components, can support high output currents in the order of 60 A. (Image from Reference 7)
- Figure 5. Shown is a Pi-type EMI filter (Image from Reference 9)
